十月，云淡气爽，我们迎来了中华人民共和国七十二岁华诞。国庆前夕，甘井公司也迎来了杜邦联合莱尔德高性能材料公司带来的深度产品培训和应用案例交流会，可谓双喜临门。

9月29日下午，杜邦联合莱尔德资深技术专家对甘井公司相关人员进行了莱尔德导热界面材料（TIM）的技术培训及其在5G技术、数据通讯和汽车电子等领域的案例分享与技术前瞻。本次培训，是杜邦完成对莱尔德高性能材料公司收购之后首次对重要经销商进行的莱尔德产品培训和技术交流。

莱尔德导热界面材料（TIM）具有高性价比、高性能等特点，其设计制造的导热产品包括导热垫、相变材料、导热硅脂和导热绝缘材料，旨在提供最广泛的产品系列以满足各种设计挑战。尤其在5G应用方面，莱尔德在通讯领域深耕多年，其开发的产品不但具备高导热系数（7.5W/mK），而且还兼具超软和低挥发、低渗油等功能。

随着莱尔德的加入，极大地强化杜邦作为主要电子原始设备制造商和其它制造商重要合作伙伴的实力。杜邦将自身在特种薄膜、软板材料、干膜和电镀化学领域的先进知识及技术组合与莱尔德高性能材料的热管理和电磁屏蔽解决方案结合在一起，通过领先的创新科技和产品组合，解决电子行业大趋势面临的关键挑战。合并后的事业体将成为5G、人工智能、智能/电动汽车、物联网和高性能计算等快速增长市场的先进电子应用的领导者，共同推动未来的行业发展。

通过本次培训，甘井参训人员对莱尔德高性能材料有了更深入的了解，对其市场前景及应用充满期待。甘井公司将继续依托杜邦公司对材料科学的深入研究、对技术领先的投入和承诺、以及广泛的工艺技能和悠久的创新历史，把业界顶尖企业更具前瞻性、更高性能的电子材料系列产品、服务带给客户，与客户共享行业前沿产品及技术，共同成长、实现共赢，为我国国民经济和社会的发展贡献自己的一份力量！

最后，祝我们伟大的祖国更加繁荣昌盛！


In October, the clouds were light and cool, and we welcomed the 72nd birthday of the People's Republic of China. On the eve of the National Day, Honey Spring also welcomed the in-depth product training and application case exchange meeting brought by DuPont and Laird Performance Materials, which is a double happiness.

In the afternoon of September 29, DuPont and Laird senior technical experts conducted technical training on Laird Thermal Interface Materials (TIM) and its case sharing and technology foresight in 5G technology, data communication and automotive electronics to relevant personnel of Honey Spring. This training was the first Laird product training and technical exchange for key distributors after DuPont completed the acquisition of Laird Performance Materials.

Laird Thermally Conductive Interface Materials (TIM) are cost-effective and high-performance. They are designed and manufactured to provide the broadest product portfolio to meet various design challenges, including thermally conductive mats, phase change materials, thermally conductive silicone greases and thermally conductive insulating materials. Especially for 5G applications, Laird has been working in the communication field for many years and has developed products with not only high thermal conductivity (7.5W/mK), but also super soft and low volatility and low oil penetration.

With the addition of Laird, it significantly strengthens DuPont's position as a key partner for major electronics OEMs and other manufacturers. DuPont combines its own advanced knowledge and technology portfolio in specialty films, flexible board materials, dry films and plating chemistry with Laird's thermal management and electromagnetic shielding solutions for high performance materials to address key challenges facing the electronics industry's megatrends through a leading-edge portfolio of innovative technologies and products. The combined business unit will be a leader in advanced electronics applications in fast-growing markets such as 5G, artificial intelligence, smart/electric vehicles, IoT and high performance computing, together driving the future of the industry.

Through this training, Honey Spring participants gained a deeper understanding of Laird's high-performance materials and are looking forward to their market prospects and applications. Honey Spring will continue to rely on DuPont's in-depth research in materials science, commitment to technology leadership, extensive process skills and long history of innovation to bring more forward-looking, high-performance electronic materials products and services from top companies in the industry to customers, share the industry's cutting-edge products and technologies with customers, grow together, achieve win-win, and contribute to the development of China's national economy and society! We will share the cutting-edge products and technologies with our customers, grow together, achieve win-win situation, and contribute to the development of our national economy and society!

Finally, I wish our great motherland more prosperity!