产品详细介绍
Product Details

有胶基材
Glued substrates

Pyralux® FR™ 和Pyralux® LF™铜箔基板是在DuPont Kapton® PI薄膜的单面或双面用一层专用阻燃型丙烯酸粘合剂粘结铜箔。
Pyralux® FR™ and Pyralux® LF™ copper foil substrates are copper foils bonded on one or both sides of DuPont Kapton® PI films with a special flame-retardant acrylic adhesive.

产品特点：
Product characteristics:

●可供应多种厚度的PI或接着剂的铜箔基板。
●We can supply copper foil substrates with various thicknesses of PI or adhesives.

●优良的耐热、抗湿、剥离强度、信赖性。
●Excellent heat resistance, moisture resistance, peel strength, and trustworthiness.

●电气特性佳，卓越的可挠性及尺寸稳定性。
●Excellent electrical characteristics, excellent flexibility and dimensional stability.

无胶基材
Non-adhesive substrates

      Pyralux®KP 为热塑性聚酰亚胺膜与双面铜箔压合而成的双面无胶覆铜板，捲狀材料, 100米/卷, 提供 250mm与500mm幅寬 ，主推型号KP122512E和KP182518E，材料亮点尺寸稳定性好，主要应用于LCM模组和摄像头模组领域。
      Pyralux®KP is a thermoplastic polyimide film and double-sided copper foil laminated into a double-sided adhesive-free copper laminate, rolled material, 100 meters/roll, available in 250mm and 500mm widths, the main model KP122512E and KP182518E, the material highlights good dimensional stability, mainly used in LCM modules and camera modules.

      Pyralux® AK是以铜箔压PI薄膜而成的双面无胶基材，适用于高涨缩和高延展性要求的的软板制作。
      Pyralux® AK is a double-sided adhesive-free substrate made of copper foil with PI film, suitable for the production of flexible boards with high shrinkage and ductility requirements.

      例如苹果产品高数据传输技术中使用到的软板，Pyralux® AK最符合软板对于轻、薄、高密度布线的高品质需求。
       For example, Pyralux® AK best meets the high-quality requirements for light, thin and high-densityty cabling for soft boards used in the high data transfer technology of Apple products.

       Pyralux® AC是以铜箔压PI薄膜而成的单面无胶基材，适用于FPC多层板和软硬结合板外层，产品结构齐全，适用各种厚度软板及软硬板的Stack_up需求。
       Pyralux® AC is a single-sided adhesive-free substrate made of copper foil with PI film, which is suitable for FPC multilayer boards and the outer layer of rigid-soft boards.

产品特点： 
Product Features:

●极佳的尺寸稳定性。
●Excellent dimensional stability.         

●不易吸潮。 
●Not easily absorbed by moisture

●铜-PI粘附强度高。  
●High adhesion strength of copper-PI

●极佳的耐热性。 
●Excellent heat resistance

●高温下抗老化时间长。
●Long anti-aging time at high temperature                          

●具耐热/耐湿特性。
●Heat/moisture resistant                  

●低热膨胀系数。
●Low coefficient of thermal expansion

高频高速TA系列双面无胶基材
High frequency and high-speed TA series double-sided adhesive-free substrate

       高频低损耗专用消费类电子双面无胶基材，DK3.2，DF 0.003，传输频率可达10GHZ以下，2.5db/10cm@10GHZ,2mil微带线设计，优异的静态折弯表现，2mil的线宽，弯折角度360°C， 死折半径0mm，可以＞10次，电阻率变化小于10%。应用在USB 3.0，无线充电线圈等高频低损耗等领域。
      High frequency low loss special consumer electronics double-sided adhesive-free substrate, DK3.2, DF 0.003, transmission frequency up to 10GHZ, 2.5db/10cm@10GHZ, 2mil microstrip line design, excellent static bending performance, 2mil line width, bending angle 360°C, dead bend radius 0mm, can be >10 times, resistivity change of less than 10%. Application in USB 3.0, wireless charging coils and other high frequency low loss and other fields.

PI覆盖膜
PI Coverlay Film

      Pyralux® FR™和Pyralux® LF™ 覆盖膜是在DuPont Kapton® PI薄膜的单面，粘合上一层专用阻燃型丙烯酸系粘合剂。
      Pyralux® FR™ and Pyralux® LF™ overlays are made by bonding a special flame-retardant acrylic adhesive to one side of a DuPont Kapton® PI film.        
     Pyralux® FR™ 在线路板的制作中可作为软板、刚性板的保护层，具有环保和阻焊绝缘的性能。
     Pyralux® FR™ is used as a protective layer for flexible and rigid boards in the fabrication of circuit boards with environmental and solder resist insulation properties.                                              

产品特点：
Product Features:

●电气特性佳。
●Excellent electrical characteristics.

●压着时溢出量少。
●Less spillage when pressed.

●加工性良好。
●Excellent processability. 

●柔软性优。
●Excellent softness.

杜邦粘结片（纯胶）
DuPont bonding sheet (pure adhesive)

       Pyralux® FR™和Pyralux® LF™粘结片是一种专用阻燃型丙烯酸粘合剂。粘合剂基本上用来粘结柔性内层板和刚性覆盖层。也可在钢板线路的制作过程中将柔性线路板粘结到刚性板上，及用于多层线路板的层间粘结。
      Pyralux® FR™ and Pyralux® LF™ bonding sheets are specialized flame-retardant acrylic adhesives. The adhesives are basically used to bond flexible inner laminates to rigid overlays. They can also be used for bonding flexible boards to rigid boards during the fabrication of sheet metal circuits and for interlayer bonding of multilayer circuit boards.

产品特点：
Product Features

●适宜多次压着，特性不劣化。 
●Suitable for repeated pressing, no deterioration of characteristics.

●长期优良的耐热、抗湿、信赖性。 
●Excellent long-term heat resistance, humidity resistance, and reliability.

●电气特性及可挠性佳。
●Good electrical characteristics and flexibility.