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干膜应用领域
◆Riston®产品涵盖电路板、陶瓷板和TP行业制造所需的影像转移干膜，包括曝光蚀刻、掩孔蚀刻、图形电镀、精细线路电镀/蚀刻、镍金电镀、选择性沉镍金、激光直接成像、半加成法、封装基板等。
|
干膜型号 |
厚度（UM） |
应用领域 |
主要特性 |
|
SD200 |
20，25，30，38，50 |
内层，外层酸性蚀刻图形制作 |
盖孔能力强，去膜速度快，膜屑小 |
|
外层图形电镀碱性蚀刻图形制作 |
高解像度，凹坑填覆能力强，抗渗镀，无锯齿线 |
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|
ST900 |
15，25，30，38，50 |
内层酸性蚀刻、FPC图形制作、ITO应用 |
高解像度，去膜速度快，膜屑小 |
|
PM300 |
30，38,50 |
内层，外层酸性蚀刻和碱性蚀刻 |
操作窗口宽，去膜速度快，膜屑小 |
|
FM700 |
30,40 |
内层，外层酸性蚀刻 |
产速快，去膜速度快，膜屑小 |
|
FM800 |
20,25,30 |
FPC和软硬结合板的理想选择 |
超精细解析度和附着力强 |
|
W200 |
50，55，65，75 |
选择性化学镍金表面处理 |
抗渗镀能力强，析出量低 |
|
GPM200 |
30,40,50 |
外层电镀NI/AU，薄金、厚金专用 |
抗渗镀能力强，无锯齿线 |
|
LDI7200M |
30,38 |
激光直接成像（355nm）线路形成，适合酸性蚀刻和碱性蚀刻 |
盖孔能力强，高解像度，附着力高 |
|
LDI7300M |
20,25,30,38 |
激光直接成像（355nm）线路形成 |
高解像度，附着力高，曝光速度快 |
|
LDI7500 |
20，25，30 |
激光直接成像（355nm）线路形成,适合做pitch≤80um的精细线路 |
高解像度，附着力高，曝光速度快 |
|
LDI8000 |
30,38 |
激光直接成像（405nm）线路形成 |
高稳定性，产能高 |
Dry Film Application Areas
◆Riston® products cover image transfer dry films for circuit board, ceramic board and TP industry manufacturing, including exposure etching, mask etching, graphic plating, fine line plating/etching, nickel-gold plating, selective nickel-gold deposition, laser direct imaging, semi-additive method, packaging substrates, etc.
|
Dry Film Model |
（UM）Thicknesses |
Application Areas |
Main Features |
|
SD200 |
20，25，30，38，50 |
Inner layer, outer layer acid etching graphic production |
Strong hole-covering ability, fast film removal, small film chips |
|
Production of alkaline etched graphics for outer layer graphics plating |
High resolution, high crater filling capability, anti-seepage plating, no jagged lines |
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|
ST900 |
15，25，30，38，50 |
Inner layer acid etching, FPC graphic production, ITO application |
High resolution, fast film removal, small film chip |
|
PM300 |
30，38,50 |
Inner layer, outer layer acid etching and alkaline etching |
Wide operating window, fast de-filming speed, small film chips |
|
FM700 |
30,40 |
Inner layer, outer layer acid etching |
Fast production speed, fast film removal, small film flakes |
|
FM800 |
20,25,30 |
Ideal for FPC and rigid-flex boards |
Ultra-fine resolution and high adhesion |
|
W200 |
50，55，65，75 |
Selective chemical nickel-gold surface treatment |
High resistance to seepage plating and low precipitation |
|
GPM200 |
30,40,50 |
NI/AU plating on the outer layer, for thin gold and thick gold |
High resistance to bleed plating, no jagged lines |
|
LDI7200M |
30,38 |
Laser direct imaging (355nm) line formation for acid etching and alkaline etching |
Strong hole-covering ability, high resolution, and high adhesion |
|
LDI7300M |
20,25,30,38 |
Laser direct imaging (355nm) line formation |
High resolution, high adhesion, fast exposure speed |
|
LDI7500 |
20，25，30 |
Laser direct imaging (355nm) line formation, suitable for fine lines with pitch ≤ 80um |
High resolution, high adhesion, fast exposure speed |
|
LDI8000 |
30,38 |
Laser direct imaging (405nm) line formation |
High stability, high capacity |
