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导热垫片典型材料 |
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型号 |
结构 |
厚度范围 |
导热系数 |
密度 |
介电常数@ 1 MHz |
体积电阻率（ohm-cm） |
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Tflex 300 |
陶瓷填充硅胶片 |
0.50 -5.08 mm |
1.2 |
1.8 |
4.5(@ 10 GHz) |
1 x 10^13 |
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Tflex P100 |
Tgard 内衬弹性体 |
0.50 - 5.08 mm |
1.2 |
2.3 |
7.5 |
1.3 x 10^12 |
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Tflex HR400 |
陶瓷填充硅胶弹性体 |
0.50- 10.16 mm |
1.8 |
1.9 |
4.8 |
2 x 10^13 |
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Tflex HD300 |
陶瓷填充硅胶弹性体 |
0.50 - 5.08 mm |
2.7 |
3.1 |
6.6 |
1.2 x 10^14 |
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Tflex 600 |
氮化硼填充硅胶弹性体 |
0.50- 5.08 mm |
3 |
1.3 |
3.3 (@10 GHz) |
2 x 10^13 |
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Tflex HR600 |
陶瓷填充硅胶片 |
0.25 - 5.08 mm |
3 |
2.5 |
19 |
1 x 10^13 |
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Tflex HD400 |
陶瓷填充硅胶弹性体 |
0.50 -5.08 mm |
4 |
3 |
10.7 |
2.7 x 10^14 |
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Tflex HD700 |
陶瓷填充硅胶片 |
0.50 -5.08 mm |
5 |
3.3 |
5 |
1.4 x 10^14 |
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TflexHD80000 |
陶瓷填充硅胶片 |
1.0-5.0mm |
6 |
3.3 |
9 |
1.0 x 10^16 |
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Tflex SF800 |
陶瓷填充无硅填隙料 |
0.50 - 4.06 mm |
7.8 |
3.2 |
15.9 |
5x 10^12 |
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液态间隙填材料 |
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型号 |
结构 |
导热系数（W/m-K)(固化后） |
密度 |
阻燃 |
介电击穿电压 |
介电常数 @ 1MHz |
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两部分陶瓷填充可分配硅胶填隙料 |
3.69 |
3.2 |
V-0 |
9KV AC |
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Tflex CR607 |
两部分陶瓷填充可分配硅胶填隙料 |
6.4 |
3.43 |
V-0 |
6 kV AC |
4.9 |
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单部分硅基可分配填隙料 |
2.3 |
2.48 |
V-0 |
>6KV AC |
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陶瓷填充硅胶可分配填隙料 |
3.7 |
3.2 |
V-0 |
>3KV AC |
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陶瓷填充硅胶可分配填隙料 |
6.4 |
3.45 |
V-0 |
>6KV AC (at 40 mil) |
15 |
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相变材料 |
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型号 |
厚度范围 |
导热系数（W/m-K) |
密度 |
介电常数@ 1 MHz |
体积电阻率（ohm-cm） |
相变软化温度 (⁰C) |
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3.2mm |
1.5 |
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0.076- 0.406 mm |
3.8 |
2.87 |
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3.0 x 10^12 |
50 |
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4 |
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45-60 |
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0.13- 0.64mm |
7.5 |
2.5 |
31.54 |
5.4x10^15 Ω-cm |
50-70 |
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0.13mm- 0.64mm |
5.4 |
2.5 |
22.9 |
1.5x10^13 Ω-cm |
45-70 |
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5.4 |
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45 to 70 |
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导热油脂 |
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型号 |
导热系数（W/m-K) |
密度 |
介电常数@ 1 MHz |
体积电阻率 |
热阻 (°C in |
粘合层厚度 |
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Tgrease 1500 |
1.2 |
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0.037 |
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Tgrease 2500 |
3.8 |
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3.5x10^12 |
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50µm |
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Tgrease 300X |
3 |
2.69 |
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25µm |
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Tgrease 880 |
3.1 |
2.73g/cc |
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9 x 10^13 |
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绝缘导热材料 |
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型号 |
厚度 |
伸长率 |
拉伸强度 |
击穿电压（AC） |
导热系数W/mK |
介电常数 @ 1 MHz |
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Tgard 200 |
0.25mm |
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6000 |
5 |
3.32 |
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Tgard 300 |
0.23 mm |
5% |
10 Mpa |
6000 |
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3.3 |
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Tgard 500 |
0.23 mm |
5% |
11.7 Mpa |
6000 |
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3.3 |
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备注：更详细的产品应用以及产品介绍、相关数据请查莱尔德官网，并以官网的资料为准。 |
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Typical Materials for thermally conductive gaskets |
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Model |
Structure |
Thickness range |
Thermal conductivity（W/m-K) |
Density |
Dielectric constant @ 1 MHz |
Volumetric resistivity （ohm-cm） |
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Tflex 300 |
Ceramic Filled Silicone Film |
0.50 -5.08 mm |
1.2 |
1.8 |
4.5(@ 10 GHz) |
1 x 10^13 |
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Tflex P100 |
Tgard Lined Elastomers |
0.50 - 5.08 mm |
1.2 |
2.3 |
7.5 |
1.3 x 10^12 |
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Tflex HR400 |
Ceramic-filled silicone elastomer |
0.50- 10.16 mm |
1.8 |
1.9 |
4.8 |
2 x 10^13 |
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Tflex HD300 |
Ceramic-filled silicone elastomer |
0.50 - 5.08 mm |
2.7 |
3.1 |
6.6 |
1.2 x 10^14 |
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Tflex 600 |
Boron nitride filled silicone elastomers |
0.50- 5.08 mm |
3 |
1.3 |
3.3 (@10 GHz) |
2 x 10^13 |
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Tflex HR600 |
Ceramic Filled Silicone Film |
0.25 - 5.08 mm |
3 |
2.5 |
19 |
1 x 10^13 |
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Tflex HD400 |
Ceramic-filled silicone elastomer |
0.50 -5.08 mm |
4 |
3 |
10.7 |
2.7 x 10^14 |
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Tflex HD700 |
Ceramic Filled Silicone Film |
0.50 -5.08 mm |
5 |
3.3 |
5 |
1.4 x 10^14 |
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TflexHD80000 |
Ceramic Filled Silicone Film |
1.0-5.0mm |
6 |
3.3 |
9 |
1.0 x 10^16 |
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Tflex SF800 |
Ceramic filled silicone-free gap filler |
0.50 - 4.06 mm |
7.8 |
3.2 |
15.9 |
5x 10^12 |
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Liquid gap filling material |
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Model |
Structure |
Thermal conductivity（W/m-K) |
Density |
Flame retardant |
Dielectric Breakdown Voltage （2mm) |
Dielectric constant @ 1MHz |
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Two part ceramic filled dispensable silicone gap filler |
3.69 |
3.2 |
V-0 |
9KV AC |
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Tflex CR607 |
Two part ceramic filled dispensable silicone gap filler |
6.4 |
3.43 |
V-0 |
6 kV AC |
4.9 |
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Single part silica-based dispensable gap fillers |
2.3 |
2.48 |
V-0 |
>6KV AC |
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Ceramic filling silica gel dispensable gap filler |
3.7 |
3.2 |
V-0 |
>3KV AC |
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Ceramic filling silica gel dispensable gap filler |
6.4 |
3.45 |
V-0 |
>6KV AC (at 40 mil) |
15 |
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Phase change materials |
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Model |
Thickness range |
Thermal conductivity （W/m-K) |
Density |
Dielectric constant @ 1 MHz |
Volumetric resistivity（ohm-cm） |
Phase change softening temperature (⁰C) |
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3.2mm |
1.5 |
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0.076- 0.406 mm |
3.8 |
2.87 |
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3.0 x 10^12 |
50 |
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4 |
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45-60 |
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0.13- 0.64mm |
7.5 |
2.5 |
31.54 |
5.4x10^15 Ω-cm |
50-70 |
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0.13mm- 0.64mm |
5.4 |
2.5 |
22.9 |
1.5x10^13 Ω-cm |
45-70 |
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5.4 |
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45 to 70 |
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Thermally conductive grease |
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Model |
Thermal conductivity（W/m-K) |
Density |
Dielectric constant @ 1 MHz |
Volumetric resistivity |
Thermal resistance (°C in |
Thickness of adhesive layer |
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Tgrease 1500 |
1.2 |
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0.037 |
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Tgrease 2500 |
3.8 |
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3.5x10^12 |
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50µm |
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Tgrease 300X |
3 |
2.69 |
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25µm |
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Tgrease 880 |
3.1 |
2.73g/cc |
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9 x 10^13 |
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Insulation and thermal conductivity materials |
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Model |
Thickness |
Elongation |
Tensile strength |
Breakdown voltage （AC） |
Thermal conductivity W/mK |
Dielectric constant @ 1 MHz |
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Tgard 200 |
0.25mm |
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6000 |
5 |
3.32 |
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Tgard 300 |
0.23 mm |
5% |
10 Mpa |
6000 |
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3.3 |
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Tgard 500 |
0.23 mm |
5% |
11.7 Mpa |
6000 |
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3.3 |
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Note: For more detailed product applications and product descriptions and related data, please check Laird's official website and refer to the information on the official website. |
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