产品规格:
产品特点:低介电常数,高导热率
产品应用:需要导热又要对信号送输要求损耗少的场景,如天线、基站。
Product Specifications:
Product Features: Low dielectric constant, high thermal conductivity
Product Applications: Scenarios that require thermal conductivity and low loss for signal delivery, such as antennas and base stations.
产品分类 |
产品特点 |
应用场景 |
OHS |
低介电常数、纵向高导热率 |
天线、基站 |
MT/MT+ |
良好的导热率,并兼顾机械、绝缘以及耐热性能 |
电源、电池、芯片、柔性加热器 |
AGS |
石墨化后有超高的导热率、细腻的外观和柔韧性 |
人工合成石墨用 |
Tflex导热垫片 |
柔软且导热,在保持导热性能的同时还可降低机械应力 |
用于桥接热元件与底盘或散热器组件之间的界面,如电信、IT、照明、显示等设备 |
液态间隙填料 |
对于界面有极佳的适应性,用于填充组件中较大且不均匀的间隙 |
常用于电信、数据通信汽车自动驾驶系统 |
相变导热材料 |
增强热部件和热解决方案(如散热器)之间的热传递。 这使得组件能够在较低的温度下运行,从而提高速度和延长寿命 |
消费电子、电信/数据通信、汽车电子、工业电子、医疗和军事/航空航天 |
导热油脂 |
用于需要最小粘结层、恒定压力,而且易于丝网印刷以达到最佳性能的各类应用。 |
IT、电源、照明、电信 |
备注:更详细的产品应用以及产品介绍请查询杜邦和莱尔德的官网,并以官网的资料为准。 |
Product Categories |
Product Features |
Application Scenarios |
OHS |
Low dielectric constant, high longitudinal thermal conductivity |
Antennas, base stations |
MT/MT+ |
Good thermal conductivity, combined with mechanical, insulating and thermal properties |
Power supplies, batteries, chips, flexible heaters |
AGS |
Graphitized with superb thermal conductivity, fine appearance and flexibility |
Synthetic graphite used |
Tflex Thermal Conductive Gasket |
Soft and thermally conductive, reducing mechanical stress while maintaining thermal conductivity |
Used to bridge the interface between thermal elements and chassis or heat sink components, such as telecom, IT, lighting, display and other equipment |
Liquid gap filler |
Excellent adaptability to interfaces for filling large and uneven gaps in components |
Commonly used in telecommunication, data communication car autopilot system |
Phase Change Thermally Conductive Materials |
Enhanced heat transfer between hot components and thermal solutions (e.g. heat sinks). This allows components to operate at lower temperatures, resulting in increased speed and longer life |
Consumer Electronics, Telecom/Datacom, Automotive Electronics, Industrial Electronics, Medical and Military/Aerospace |
Thermally conductive grease |
For a variety of applications that require minimal bonding layers, constant pressure, and easy screen printing for optimal performance. |
IT, Power, Lighting, Telecom |
Note: For more detailed product applications and product descriptions, please check the official websites of DuPont and Laird, and refer to the information on the official websites. |